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    작성일 : 04-04-02 00:00
    Macromolecular Science and Its Impact on Industries
     글쓴이 : 관리자 (183.♡.87.153)
    조회 : 4,884  
    ' INTERNATIONAL CONFERENCE AND EXHIBITIONon“Macromolecular Science and Its Impact on Industries” 27 – 29 September 2004Sunway Pyramid Convention Centre  Organised by Institut Kimia Malaysia (IKM) In Association with Singapore National Institute of Chemistry (SNIC) It is our great pleasure to announce that the Institut Kimia Malaysia (IKM) is organizing an International Polymer Conference and Exhibition, MCC 2004, in Kuala Lumpur from 27 to 29 September 2004.  With the ever-increasing importance of polymers in our daily life, we have chosen the theme of the Conference to be “Macromolecular Science and Its Impact on the Industries”.  One of the objectives of the Conference is to promote a better understanding of the education and training in polymer chemistry and its impact on our daily life and to provide opportunities to convert research findings into commercial applications and economic benefit.   SCIENTIFIC PROGRAMME There will be 12 sessions and a mini-symposium as follows:  Natural Rubber – Chemistry & Technology Paints, Coatings and Adhesives Polymer Blends & Composites Latex Chemistry & Technology Polymer Synthesis and Reactions Biotechnology and Biopolymers Advances in Polymer and Plastics Processing and Engineering Instrumentation in Macromolecular Science Impact on Ecology and Environment Resins, Chemicals, Fillers and Packaging Materials Advances in Industrial Applications Textiles and fibers Minisymposium on Green Polymers       International co-organizer :Kanji Kajiwara (Japan)   CALL FOR PAPERS & EDITORIAL REQUIREMENTS     Participants of the Conference who intend to present papers for the oral or poster sessions are requested to submit their abstract of papers before the 30 of April 2004.  All authors are required to submit the abstracts through email or diskette/CD-ROM, to the Secretariat directly.  Fax copies will NOT be accepted.Authors will be informed by 15 May 2004 whether their paper has been accepted. Abstract Format    Abstract must be written in English only.   Type the abstract title in BOLD using upper and lower case letters, and 12 point Arial or similar (sans serif) font using MS Office Word 97 and above.  Begin a new line for authors / affiliations.  List all authors and then list all affiliations. Use initials for first and middle names.  Please underline the name of the presenting author.  When more than one author is listed, use superscript numbers to match authors and affiliations. Begin a new line and give the email address of the presenting author. Type the body of the abstract using 12 point Arial or similar (serif) font. The abstract should be typed single-spaced with one line of space between paragraphs.  The abstract narrative containing all the relevant information should not exceed 300 words. The full manuscript must be submitted by email directly to the Secretariat before 15 July 2004 .  REGISTRATION FEES The registration fee covers the full cost of attendance, including conference materials, coffee and tea breaks and lunches and an invitation to the conference Banquet.                                                       Before 30 June 2004      After 30 June 2004     IKM members                             RM 600.00                               RM 700.00       Non-IKM members                                    RM 800.00                               RM 900.00Foreign participants                               USD 400.00                              USD 500.00 Full time postgraduate students will be entitled to a 25% off the registration fee. Cheques are to be made payable to “Institut Kimia Malaysia”FURTHER INFORMATIONFor further details, please contact:Conference SecretariatINSTITUT KIMIA MALAYSIANo. 127B, Jalan Aminuddin BakiTaman Tun Dr. Ismail60000 Kuala Lumpur, MalaysiaTel:03-77283272   Fax: 03-77289909email:  ikmmy@pc.jaring.my,    ikmmy@tm.net.myConference email: mcc2004@ikm.org.myConference website:  http://www.ikm.org.my/mcc2004.htm한국섬유공학회'