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    한국섬유공학회지, Vol.55, No.1, pp. 35-40, 2018
    Boron Nitride를 함유한 열경화성 액정 에폭시의 열분해 거동
    Thermal Decomposition Behavior of LCT Composites Using Boron Nitride Filler
     
    황보세진 · 조승현
     
    A liquid crystalline thermosetting-epoxy-based composite was fabricated using diglycidyl ether of 4,4'-biphenol, boron nitride as the filler, and sulfanilamide as the curing agent. To investigate the thermal behavior, thermogravimetric analysis was performed, and temperature differences of the sample were recorded when using 1.0−7.0 wt.% boron nitride. The activation energy for thermal decomposition was calculated using the Kissinger method and Flynn-wall method. The results showed that the activation energy was proportional to the amount of added filler.
     
    Keywords : liquid crystalline thermosetting epoxy, boron nitride, activation energy for thermal decomposition, Kissinger method, Flynn-wall method
    DOI :
     
    Full text(PDF)  Boron Nitride를 함유한 열경화성 액정 에폭시의 열분해 거동